PERMANENT AWARD EVIDENCE
University of Bristol · published 1 Jul 2026. This page preserves the identifiers and current held fields for one Contracts Finder release; it is not an invoice, performance assessment or complete contract history.
21933349-7465-49c1-a0c0-59f1caeb33ed-904105ocds-b5fd17-70b4946f-879f-4cc8-b8ca-342875acc7bfGB-CFS-145259A tender estimate and an award value answer different questions. Neither is treated as cash paid.
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
The current projection contains one award release, not a verified chain of planning, tender, award, contract and modification records. Dates are shown in source-field order and are not silently repaired.
A company profile appears only when this release carries a usable company number. Name-only suppliers remain name-only.
No supplier is named in this projection. That does not prove the notice had no supplier in every source version.
Published 1 Jul 2026 · held through the daily award projection · Open Government Licence v3.0.